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MT46H32M16LFBF-6:B 其他数据使用手册 - Micron（镁光）
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Micron（镁光）
分类:
RAM芯片
封装:
BGA
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MT46H32M16LFBF-6:B数据手册
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Table 2: Configuration Addressing 512
Architecture 32 Meg x 16 16 Meg x 32 Reduced Page-Size Option 16 Meg x 32
Configuration 8 Meg x 16 x 4 banks 4 Meg x 32 x 4 banks 4 Meg x 32 x 4 banks
Refresh count 8K 8K 8K
Row addressing A[12:0] A[12:0] A[13:0]
Column addressing A[9:0] A[8:0] A[7:0]
Figure 1: 512Mb Mobile LPDDR Part Numbering
MT 46 H 32M16 LF BF -6 L IT :B
Micron Technology
Product Family
46 = Mobile LPDDR
Operating Voltage
H = 1.8V/1.8V
HC = 1.8V/1.2V
Configuration
32 Meg x 16
16 Meg x 32
Addressing
LF = Mobile standard addressing
LG = Reduced page-size option
Package Codes
BF = 8mm x 9mm, VFBGA, green
CM = 10mm x 13mm, VFBGA, green
CX = 9mm x 13mm, VFBGA, green
Design Revision
:B = Second generation
Operating Temperature
Blank = Commercial (0°C to +70°C)
IT = Industrial (–40°C to +85°C)
Power
Blank = Standard Idd2/Idd6
L = Low-power Idd2/Idd6
Cycle Time
-5 = 5ns
t
CK, CL = 3
-54 = 5.4ns
t
CK, CL = 3
-6 = 6ns
t
CK, CL = 3
-75 = 7.5ns
t
CK, CL = 3
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at www.micron.com/decoder.
512Mb: x16, x32 Mobile LPDDR SDRAM
Features
PDF: 09005aef82d5d305
512mb_ddr_mobile_sdram_t47m.pdf - Rev. H 03/09 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2004 Micron Technology, Inc. All rights reserved.
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