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NB7L86M数据手册
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QFN16 3x3, 0.5P
CASE 485G01
ISSUE F
DATE 22 JUN 2011
SCALE 2:1
16X
SEATING
PLANE
L
D
E
0.10 C
A
A1
e
D2
E2
b
1
4
8
9
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
B
A
0.10 C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
LOCATION
0.05 C
0.05 C
(A3)
C
NOTE 4
16X
0.10 C
0.05 C
A B
NOTE 3
K
16X
1
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
ÉÉ
ÉÉ
ÇÇ
A1
A3
L
ÉÉ
ÉÉ
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL A
DETAIL B
GENERIC
MARKING DIAGRAM*
XXXXX = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = PbFree Package
XXXXX
XXXXX
ALYWG
G
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “G”,
may or may not be present.
(Note: Microdot may be in either location)
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
RECOMMENDED
2X
0.50
PITCH
1.84
3.30
1
DIMENSIONS: MILLIMETERS
0.58
16X
2X
0.30
16X
OUTLINE
PACKAGE
2X
2X
0.10 C A B
e/2
SOLDERING FOOTPRINT*
DIM MIN NOM MAX
MILLIMETERS
A 0.80 0.90 1.00
A1 0.00 0.03 0.05
A3 0.20 REF
b 0.18 0.24 0.30
D 3.00 BSC
D2 1.65 1.75 1.85
E 3.00 BSC
E2 1.65 1.75 1.85
e 0.50 BSC
K 0.18 TYP
L 0.30 0.40 0.50
L1 0.00 0.08 0.15
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON04795D
ON SEMICONDUCTOR STANDARD
QFN16, 3X3 MM, 0.5 PITCH
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
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