Datasheet 搜索 > Flash芯片 > Cypress Semiconductor（赛普拉斯） > S29JL064J70TFI000 数据手册 > S29JL064J70TFI000 产品修订记录 1/7 页
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S29JL064J70TFI000 产品修订记录 - Cypress Semiconductor（赛普拉斯）
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Cypress Semiconductor（赛普拉斯）
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Flash芯片
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TSOP-48
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JL-J 系列 64 M (8M x 8位/4M x 16位) 3.6 V 读/写 闪存 -TSOP-48
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S29JL064J70TFI000数据手册
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Spansion Confidential
ACN# 2843
Issue Date : 12/21/12
December 21, 2012
Mr. Kimbrell
NEWARK ELECTRONICS
4801 North Ravenswood Ave
Chicago 60640-4495
USA
Dear Mr. Kimbrell
Advanced Change Notification #: 2843
Change Title: Qualification of an Alternate Mold Compound (Sumitomo G600B/
G600SB) and Die Attach Epoxy (Sumitomo CRM-1150B) for TSOP
Packages (Thin Small Outline Package)
Spansion LLC is announcing the planned qualification of an alternate mold compound (Sumitomo
G600B/G600SB) and die attach epoxy (Sumitomo CRM-1150B) for assembly of all TSOP packages.
This change is being made to ensure sufficient assembly material availability and increase flexibility,
as a preventive action to ensure uninterrupted supply. Upon completion of this qualification, all devices
assembled in TSOP packages will be considered qualified by similarity. Additional future ordering part
numbers (OPNs) assembled in these packages may be assembled with any qualified die attach epoxy
and mold compound. The OPNs currently affected by this change are listed below. See below for
details:
Product Identification: All Ordering Part Numbers for TSOP packages.
Package Types: All TSOP 40 / 48 / 56 Packages
Description of Change: Qualification of Sumitomo CRM-1150B Die Attach Epoxy and G600B/
G600SB Mold Compound for TSOP packages.
Reason for Change: To increase assembly flexibility and ensure assembly material
availability as a preventive action to ensure uninterrupted supply.
Application Impact: There is no expected impact on application, function, use or quality and
reliability. There will be no change to the datasheet.
Qual Description: Q100252 / Q100358 / Q100420
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