Datasheet 搜索 > 接口芯片 > TI（德州仪器） > SN65LVDT2DBVR 数据手册 > SN65LVDT2DBVR 产品修订记录 5/6 页
￥ 6.906
SN65LVDT2DBVR 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
接口芯片
封装:
SOT-23-5
描述:
HIGH -SPEED微分方程线路驱动器/接收机 HIGH-SPEED DIFFERENTAIL LINE DRIVER/RECEIVERS
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P4P5
型号编号列表在P2
导航目录
SN65LVDT2DBVR数据手册
Page:
of 6 Go
若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN# 20150713000
Type
Test Name / Condition
Duration
Qual Device:
INA168NA
Qual Device:
OPA244NA
TC
Temperature Cycle -65/150C
500 Cycles
1/77/0
1/77/0
- Preconditioning was performed for Autoclave, Unbiased HAST, THB/Biased HAST, Temperature Cycle, Thermal Shock, and HTSL, as
applicable
- The following are equivalent HTOL options based on an activation energy of 0.7eV : 125C/1k Hours, 140C/480 Hours, 150C/300 Hours, and
155C/240 Hours
- The following are equivalent HTSL options based on an activation energy of 0.7eV : 150C/1k Hours, and 170C/420 Hours
- The following are equivalent Temp Cycle options per JESD47 : -55C/125C/700 Cycles and -65C/150C/500 Cycles
Quality and Environmental data is available at TI's external Web site: http://www.ti.com/
Green/Pb-free Status:
Qualified Pb-Free(SMT) and Green
NFME Qualification of the DBV packages with R-13 mold compound
Product Attributes
Attributes
Qual Device:
OPA365AIDBV
Qual Device:
THS4304DBV
Qual Device:
THS9001DBV
Qual Device:
TPS3809I50DBV
Qual ID
20090808-8742
20090808-8742
20090808-8742
20090808-8742
Assembly Site
NFME
NFME
NFME
NFME
Package Family
SOT
SOT
SOT
SOT
Flammability Rating
UL 94 V-0
UL 94 V-0
UL 94 V-0
UL 94 V-0
Wafer Fab Supplier
DMOS5
FFAB
FFAB
DFAB
Wafer Fab Process
50HPA07
BICOM3
RFSige
LBC3
- QBS: Qual By Similarity
- Qual Device OPA365AIDBV is qualified at LEVEL1-260C
- Qual Device THS4304DBV is qualified at LEVEL1-260C
- Qual Device THS9001DBV is qualified at LEVEL1-260C
- Qual Device TPS3809I50DBV is qualified at LEVEL1-260C
Qualification Results
Data Displayed as: Number of lots / Total sample size / Total failed
Type
Test Name / Condition
Duration
Qual Device:
OPA365AIDBV
Qual Device:
THS4304DBV
Qual Device:
THS9001DBV
Qual Device:
TPS3809I50DBV
AC
Autoclave 121C
96 Hours
1/77/0
1/77/0
1/77/0
-
HTSL
High Temp Storage Bake 170C
420 Hours
1/77/0
1/74/0
1/77/0
-
LI
Lead Fatigue
Leads
1/22/0
1/22/0
1/22/0
1/22/0
LI
Lead Pull to Destruction
Leads
1/22/0
1/22/0
1/22/0
1/22/0
MISC
Salt Atmosphere
24 Hours
1/22/0
1/22/0
1/22/0
1/22/0
PD
Physical Dimensions
--
1/5/0
1/5/0
1/5/0
1/5/0
PKG
Lead Finish Adhesion
Leads
1/15/0
1/15/0
1/15/0
1/15/0
SD
Surface Mount Solderability
Pb Solder
1/22/0
1/22/0
1/22/0
1/22/0
TC
Temperature Cycle, -65/150C
500 Cycles
1/77/0
1/77/0
1/77/0
-
TS
Thermal Shock -65/150C
500 Cycles
1/77/0
1/77/0
1/77/0
-
WBP
Bond Pull
Wires
1/78/0
1/78/0
1/78/0
1/78/0
WBS
Ball Bond Shear
Wires
1/78/0
1/78/0
1/78/0
1/78/0
- Preconditioning was performed for Autoclave, Unbiased HAST, THB/Biased HAST, Temperature Cycle, Thermal Shock, and HTSL, as
applicable
- The following are equivalent HTOL options based on an activation energy of 0.7eV : 125C/1k Hours, 140C/480 Hours, 150C/300 Hours, and
155C/240 Hours
- The following are equivalent HTSL options based on an activation energy of 0.7eV : 150C/1k Hours, and 170C/420 Hours
- The following are equivalent Temp Cycle options per JESD47 : -55C/125C/700 Cycles and -65C/150C/500 Cycles
Quality and Environmental data is available at TI's external Web site: http://www.ti.com/
Green/Pb-free Status:
Qualified Pb-Free(SMT) and Green
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
