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TA8201AK 其他数据使用手册 - Toshiba（东芝）
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TA8201AK数据手册
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MAY 1998 - REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP8200M & TISP8201M
TISP8200M, BUFFERED P-GATE SCR DUAL
TISP8201M, BUFFERED N-GATE SCR DUAL
COMPLEMENTARY BUFFERED-GATE SCRS
FOR DUAL POLARITY SLIC OVERVOLTAGE PROTECTION
TISP8200M Device Symbol
High Performance Protection for SLICs with +ve & -ve Battery
Supplies
TISP8200M, Negative Overvoltage Protector
– Wide 0 to -90 V Programming Range
– Low 5 mA max. Gate Triggering Current
– High -150 mA min. Holding Current
TISP8201M, Positive Overvoltage Protector
– Wide 0 to +90 V Programming Range
– Low -5 mA max. Gate Triggering Current
– 20 mA min. Holding Current
Rated for International Surge Wave Shapes
How To Order
TISP8200M D Package (Top View)
Description
The TISP8200M/TISP8201M combination has been designed to protect
dual polarity supply rail monolithic SLICs (Subscriber Line Interface
Circuits) against overvoltages on the telephone line caused by lightning,
a.c. power contact and induction. Protection against negative
overvoltages is given by the TISP8200M. Protection against positive
overvoltages is given by the TISP8201M. Both parts are in 8-pin small-
outline surface mount packages.
The TISP8200M has an array of two buffered P-gate SCRs with a
common anode connection. Each SCR cathode and gate has a separate
terminal connection. The NPN buffer transistors reduce the gate supply
current.
In use, the cathodes of the TISP8200M SCRs are connected to the two
conductors of the POTS line (see applications information). The gates are
connected to the appropriate negative voltage battery feed of the SLIC
driving the line conductor pair. This ensures that the TISP8200M
protection voltage tracks the SLIC negative supply voltage. The anode of
the TISP8200M is connected to the SLIC common.
Surface Mount Small-Outline Package
1
2
3
4
5
6
7
8
MDRXAKC
NC - No internal connection
G2
A
A
G1
K1
K2
NC
NC
SDRXAJB
A
A
G1
G2
K1
K2
TISP8201M Device Symbol
TISP8201M D Package (Top View)
1
2
3
4
5
6
7
8
MDRXALC
NC - No internal connection
G2
K
K
G1
A1
A2
NC
NC
SDRXAKB
A1
A2
K
K
G1
G2
Wave Shape Standard
I
tsp
A
2/10 µs Telcordia GR-1089-CORE 210
10/700 µs ITU-T K.20, K.21 & K.45 70
10/1000 µs Telcordia GR-1089-CORE 45
............................................ UL Recognized Components
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Device Package Carrier
TISP8200M D (8-pin Small-Outline) Embossed Tape Reeled
TISP8201M D (8-pin Small-Outline) Embossed Tape Reeled
TISP8200MDR-S
TISP8201MDR-S
Order As
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