Datasheet 搜索 > DC/DC转换器 > TI（德州仪器） > TPS62130RGTRF0 数据手册 > TPS62130RGTRF0 其他数据使用手册 1/4 页
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TPS62130RGTRF0 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DC/DC转换器
封装:
QFN-16
描述:
开关稳压器 Buck Converter
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
功能描述在P1
导航目录
TPS62130RGTRF0数据手册
Page:
of 4 Go
若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN# 20140327000
PCN Number:
20140327000
PCN Date:
03/31/2014
Title:
Qualification of Carsem Suzhou (CSZ) as Additional Assembly and Test Site for select
devices in QFN package
Customer Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality Services
*Proposed 1
st
Ship Date:
07/01/2014
Estimated Sample
Availability:
Date Provided at
Sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Qualification of Carsem Suzhou (CSZ) as Additional Assembly and Test Site for select devices in
QFN package. Material differences are shown in the following table:
Group 1 Device: Additional A/T site
NSE
MLA
TI Clark
CSZ
Mount Compound
PZ0031
4207768
4207768
435143
Group 2 Device: Additional A/T site with Cu Wire
NSE
MLA
TI Clark
CSZ
Mount Compound
PZ0031
4207768
4207768
435143
Wire
Au
Au
Au
Cu
Test coverage, insertions, conditions will remain consistent with current testing and verified with
test MQ.
Reason for Change:
Continuity of supply.
1) To align with world technology trends and use wiring with enhanced mechanical and
electrical properties
2) Maximize flexibility within our Assembly/Test production sites.
3) Cu is easier to obtain and stock
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
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