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TPS62175EVM-098 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
开发板
描述:
TEXAS INSTRUMENTS TPS62175EVM-098 评估模块, TPS62175EVM-098
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P4Hot
典型应用电路图在P21P22P31P32
原理图在P12
封装尺寸在P37P39P40
标记信息在P37
封装信息在P37P38P39P40
技术参数、封装参数在P4
应用领域在P21
电气规格在P5P6P7P17
导航目录
TPS62175EVM-098数据手册
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4
TPS43060
,
TPS43061
ZHCSAP1D –DECEMBER 2012–REVISED SEPTEMBER 2014
www.ti.com.cn
Copyright © 2012–2014, Texas Instruments Incorporated
Pin Functions (continued)
PIN
DESCRIPTION
NAME NO.
PowerPAD 17
The PowerPAD should be connected to AGND. If possible, use thermal vias to connect to an internal ground plane
for improved power dissipation.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted)
MIN MAX UNIT
Voltage
Input: VIN, EN, ISNS+, ISNS– –0.3 40 V
DC voltage: SW –0.6 60 V
Transient voltage (10 ns max): SW –2 60 V
FB, RT/CLK, COMP, SS –0.3 3.6 V
BOOT, HDRV voltage with respect to ground 65 V
BOOT, HDRV voltage with respect to SW pin 8 V
VCC, PGOOD, LDRV –0.3 8 V
Operating junction temperature –40 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range –65 150 °C
V
(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
–2000 2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins
(2)
–500 500
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
IN
Input voltage range 4.5 38 V
V
OUT
Output voltage range V
IN
58 V
V
EN
EN voltage range 0 38 V
V
CLK
External switching frequency logic input range 0 3.6 V
T
J
Operating junction temperature –40 150 °C
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.4 Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC
(1)
WQFN
(16-PINS)
UNIT
R
θJA
Junction-to-ambient thermal resistance 65.7
°C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 42.3
R
θJB
Junction-to-board thermal resistance 18
ψ
JT
Junction-to-top characterization parameter 0.9
ψ
JB
Junction-to-board characterization parameter 17.9
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 22.7
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