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XCF01SVOG20C 产品修订记录 - Xilinx（赛灵思）
制造商:
Xilinx（赛灵思）
分类:
EEPROM芯片
封装:
TSSOP-20
描述:
XILINX XCF01SVOG20C 芯片, 存储器, PROM, 闪存平台, 1Mb, 20TSSOP
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XCN16001 February 22, 2016 www.xilinx.com 1
Assembly Location Change
Plus Mold Compound and Silver
Epoxy Change for Platform
Flash VOG20 Packages
XCN16001 February 22, 2016
Product Change Notice
Overview
The purpose of this notification is to communicate two changes to the 1-Mbit, 2-Mbit, and 4-Mbit Platform Flash
devices of the Xilinx In-System Programmable Configuration PROMs.
• A
ssembly and finish plant location change for all TSSOP20 (VOG20) packages from the current Amkor
Philippines to the ASE-SH, China location.
• C
onsolidation of both mold compound and silver epoxy material to ensure use of the same mold compound
across all TSOP20 packages. The mold compound and silver epoxy for VOG20 packages will be changed to
the same as the mold compound already in volume production for the new assembly house.
T
here is no change to the form, fit, or function of these devices.
Description
The TSOP20 assembly and finish plant is being moved from the current Amkor Philippines to the Advanced
Semiconductor Engineering, Shanghai Inc. ASE-SH, China location. The ASE Group is the world’s largest provider
of independent semiconductor manufacturing services in assembly and test.
A
s a part of this transition, the molding compound & silver epoxy used for the Platform Flash VOG20 Pb-free
packages is also being changed from Sumitomo G700K to Hitachi CEL9240HF Epoxy molding compound &
Ablestick 8290 to Hitachi Hitachi EN-4900GC silver epoxy. Both mold compound & silver epoxy material are used in
the standard (Pb-free) VOG20 Platform Flash products which have been shipping in volume production for several
years. These consolidations are designed in ASE-SH to make Platform Flash manufacturing more efficient and
timely, enabling smoother supply to Xilinx customers. This is not a process or technology change and has no impact
to form, fit, or function of the products.
Products Affected
This change affects (XC) grade device including all versions under specification control documentation (SCD)
reference. Please reference the Traceability section for further information on identifying these products.
T
his notification applies only to the following Xilinx commercial part numbers (see Table 1
).
Table 1: Affected Devices for the Platform Flash VOG20 package
Xilinx part number Xilinx part number Xilinx part number Xilinx part number
XCF01SVOG20C XCF02SVOG20C XCF04SVOG20C XCF04SVOG20C4294
XCF01SVOG20C0100 XCF02SVOG20C0100 XCF04SVOG20C0100
Key Dates and Ordering Information
Xilinx has successfully qualified ASE-SH in Aug’15. Xilinx will begin to cross ship both current and new supplier’s
package by Jun 01, 2016. Qualification report is updated in RPT#222.
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