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器件3D模型￥ 21.545
AD7689BCPZ 数据手册 - ADI（亚德诺）
制造商:
ADI（亚德诺）
分类:
AD转换器
封装:
LFCSP-20
描述:
ANALOG DEVICES AD7689BCPZ 模数转换器, 八路 MUX, 16 bit, 250 kSPS, 单, 2.3 V, 5.5 V, LFCSP
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AD7689BCPZ数据手册
Page:
of 11 Go
若手册格式错乱，请下载阅览PDF原文件
AD7689-KGD Known Good Die
Rev. B | Page 10 of 10
OUTLINE DIMENSIONS
2.43 SQ
03-23-2017- A
1
20
23 35
6
7
8
9
10
11 12 13 14
15
16
17
18
19
0.25
0.08 × 0.08
TOP VIEW
(CIRCUIT SIDE)
SIDE VIEW
Figure 5. 20-Pad Bare Die [CHIP]
(C-20-2)
Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS
Table 7. Die Specifications
Parameter Value Unit
Scribe Line Width 80 × 80 µm
Die Size (Maximum Size) 2430 × 2430 µm
Thickness 250 µm
Bond Pads (Minimum Size) 80 × 80 µm
Bond Pad Composition 0.5 AlCu %
Backside Standard assembly die attach Not applicable
Passivation Oxynitride Not applicable
Chip Size 2350 × 2350 µm
Table 8. Assembly Recommendations
Assembly Component Recommendation
Die Attach Epoxy adhesive
Bonding Method
Gold ball
1
or aluminum wedge
Bonding Sequence Bond pin five first
1
Evaluate the gold wire for suitability before use at elevated temperatures for extended durations.
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD7689-KGD-PT −40°C to +85°C 20-Pad Bare Die [CHIP] C-20-2
©2017–2018 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15658-0-2/18(B)
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