Datasheet 搜索 > FPGA芯片 > Microsemi（美高森美） > APA300-FGG144M 数据手册 > APA300-FGG144M 数据手册 3/178 页
器件3D模型￥ 272.12
APA300-FGG144M 数据手册 - Microsemi（美高森美）
制造商:
Microsemi（美高森美）
分类:
FPGA芯片
封装:
FBGA
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P83P85P171P172P174P175Hot
原理图在P16P21P32P33P172P174P175
型号编码规则在P2P3P169P170P171P172P174
封装信息在P2
功能描述在P1P11P16P20P171P172P174P175
技术参数、封装参数在P6P17P28P41P44P45P46P47P48P49P50P51
应用领域在P8P176
电气规格在P28P44P45P46P47P48P49P169P171P172P174P175
导航目录
APA300-FGG144M数据手册
Page:
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若手册格式错乱，请下载阅览PDF原文件
ProASIC
PLUS
Flash Family FPGAs
v5.9 iii
Device Resources
General Guideline
Maximum performance numbers in this datasheet are based on characterized data. Actel does not guarantee
performance beyond the limits specified within the datasheet.
User I/Os
2
Commercial/Industrial
Military/MIL-STD-883B
Device
TQFP
3
100-Pin
TQFP
3
144-Pin
PQFP
3
208-Pin
PBGA
3
456-Pin
FBGA
3
144-Pin
FBGA
3
256-Pin
FBGA
3
484-Pin
FBGA
3
676-Pin
FBGA
3
896-Pin
FBGA
3
1152-Pin
CQFP
208-Pin
CQFP
352-Pin
CCGA/
LGA
624-Pin
APA075 66 107 158 100
APA150 66 158 242 100 186
4
APA300 158
5
290
5
100
5
186
4, 5
158 248
APA450 158 344 100 186
4
344
4
APA600 158
5
356
5
186
4, 5
370
4
454 158 248 440
APA750 158 356 454 562
6
APA1000 158
5
356
5
642
5, 6
712
6
158 248 440
Notes:
1. Package Definitions: TQFP = Thin Quad Flat Pack, PQFP = Plastic Quad Flat Pack, PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch Ball Grid
Array, CQFP = Ceramic Quad Flat Pack, CCGA = Ceramic Column Grid Array, LGA = Land Grid Array
2. Each pair of PECL I/Os is counted as one user I/O.
3. Available in RoHS compatible packages. Ordering code is "G."
4. FG256 and FG484 are footprint-compatible packages.
5. Military Temperature Plastic Package Offering
6. FG896 and FG1152 are footprint-compatible packages.
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