Datasheet 搜索 > 移位寄存器 > TI（德州仪器） > CD74HCT166M 数据手册 > CD74HCT166M 数据手册 5/16 页
器件3D模型￥ 2.64
CD74HCT166M 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
移位寄存器
封装:
SOIC-16
描述:
TEXAS INSTRUMENTS CD74HCT166M 移位寄存器, HCT系列, 并行至串行, 1元件, SOIC, 16 引脚, 4.5 V, 5.5 V
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CD74HCT166M数据手册
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5
MR Pulse Width
(Figure 1)
t
w
2 100 - 125 - 150 - ns
4.5 20 - 25 - 30 - ns
617-21-26-ns
Clock Pulse Width
(Figure 1)
t
W
2 80 - 100 - 120 - ns
4.5 16 - 20 - 24 - ns
614-17-20-ns
Set-up Time
Data and CE to Clock
(Figure 5)
t
SU
2 80 - 100 - 120 - ns
4.5 16 - 20 - 24 - ns
614-17-20-ns
Hold Time
Data to Clock
(Figure 5)
t
H
21-1-1-ns
4.51-1-1-ns
61-1-1-ns
Removal Time
MR to Clock
(Figure 5)
t
REM
20-0-0-ns
4.50-0-0-ns
60-0-0-ns
Set-up Time
PE to CP
(Figure 5)
t
SU
2 145 - 180 - 220 - ns
4.5 29 - 36 - 44 - ns
625-31-38-ns
Hold Time
PE to CP or CE
(Figure 5)
t
H
20-0-0-ns
4.50-0-0-ns
60-0-0-ns
HCT TYPES
Clock Frequency (Figure 2) f
MAX
4.5 25 - 20 - 16 - MHz
MR Pulse Width (Figure 2) t
w
4.5 35 - 44 - 53 - ns
Clock Pulse Width (Figure 2) t
w
4.5 20 - 25 - 30 - ns
Set-up Time Data and CE to
Clock (Figure 6)
t
SU
4.5 16 - 20 - 24 - ns
Hold Time Data to Clock
(Figure 6)
t
H
4.50-0-0-ns
Removal Time MR to Clock
(Figure 6)
t
REM
4.50-0-0-ns
Set-up Time PE to CP (Figure 6) t
SU
4.5 30 - 38 - 45 - ns
Hold Time PE to CP or CE
(Figure 6)
t
H
4.50-0-0-ns
Switching Specifications Input t
r
, t
f
= 6ns
PARAMETER SYMBOL
TEST
CONDITIONS V
CC
(V)
25
o
C -40
o
C TO 85
o
C -55
o
C TO 125
o
C
UNITSTYP MAX MAX MAX
HC TYPES
Propagation Delay,
Clock to Output (Figure 3)
t
PLH
, t
PHL
C
L
= 50pF 2 - 160 200 240 ns
4.5 - 32 40 48 ns
C
L
= 15pF 5 13 - - - ns
CL = 50pF 6 - 27 34 41 ns
Prerequisite For Switching Specifications (Continued)
PARAMETER SYMBOL V
CC
(V)
25
o
C -40
o
C TO 85
o
C -55
o
C TO 125
o
C
UNITSMIN MAX MIN MAX MIN MAX
CD54HC166, CD74HC166, CD54HCT166, CD74HCT166
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