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CMH04 数据手册 - Toshiba(东芝)
制造商:
Toshiba(东芝)
封装:
M-FLAT
描述:
200V VRRM 1.0A 0.98V VFM 20A REC
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
标记信息在P2
技术参数、封装参数在P1
应用领域在P1P5
电气规格在P1
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CMH04数据手册
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CMH04
2013-11-01
2
Marking
Abbreviation Code Part No.
H4 CMH04
Standard Soldering Pad
Handling Precaution
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
V
RRM
: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of V
RRM
for a DC circuit and be no greater than 50% of that of V
RRM
for an AC circuit.
V
RRM
has a temperature coefficient of 0.1%/℃. Take this temperature coefficient into account designing a
device at low temperature.
I
F(AV)
: We recommend that the worst case current be no greater than 80% of the absolute maximum rating of I
F(AV)
.
Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by
using an allowable Tamax-I
F (AV)
curve.
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180.
Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at a Tj of below 120℃ under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
3.0 1.4
2.1
Unit: mm
1.4
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