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CMH04 数据手册 - Toshiba（东芝）
制造商:
Toshiba（东芝）
封装:
M-FLAT
描述:
200V VRRM 1.0A 0.98V VFM 20A REC
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
标记信息在P2
技术参数、封装参数在P1
应用领域在P1P5
电气规格在P1
导航目录
CMH04数据手册
Page:
of 5 Go
若手册格式错乱，请下载阅览PDF原文件
CMH04
2013-11-01
3
Average forward current I
F (AV)
(A)
P
F (AV)
– I
F (AV)
Average forward power dissipation
P
F (AV)
(W)
0
0
0.4
1.0
0.2 0.4 0.6 0.8 1.0
0.2
0.6
0.8
360°
0°
180°
Rectangular
W
a
v
e
f
o
rm
Instantaneous forward voltage v
F
(V)
i
F
– v
F
Instantaneous forward current i
F
(A)
0.2 0.4
0.01
1
100
0.6 0.8 1.0 1.2 1.4
150°C
T
j
= 25°C
75°C
1.6
0.1
10
1.2
1.2
Pulse test
1.8
Average forward current I
F (AV)
(A)
Ta ma x – I
F (AV)
Maximum allowable ambient temperature
Ta max (°C )
160
60
0
20
40
80
100
120
140
0 0.4 0.6 1.0 0.8 1.2 0.2
360°
0°
180°
Rectangular
Waveform
Average forward current I
F (AV)
(A)
Ta ma x – I
F (AV)
160
60
0
20
40
80
100
120
140
0.2 0 0.4 0.6 1.0 0.8 1.2
Maximum allowable ambient temperature
Ta m ax (°C )
360°
0°
180°
Rectangular
Waveform
Transient thermal impedance
r
th (j-a)
(°C/W)
Time t (s)
r
th (j-a)
– t
1000
1
100
10
0.001 1000 0.01 0.1 100 10 1
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
board thickness: 1.6 mm
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 mm
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 mm
3
5
30
50
300
500
0.003 0.03 0.3 3 30 300
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 mm
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 mm
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