Datasheet 搜索 > 稳压芯片 > TI（德州仪器） > LP5907UVE-1.8/NOPB 数据手册 > LP5907UVE-1.8/NOPB 数据手册 18/36 页
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LP5907UVE-1.8/NOPB 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
XFBGA-4
描述:
TEXAS INSTRUMENTS LP5907UVE-1.8/NOPB 固定电压稳压器, LDO, 2.2V至5.5V, 120mV压差, 1.8V输出, 250mA输出, DSBGA-4
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P13
原理图在P1P11
封装尺寸在P20P23P24P25P27P28P29P30P33
焊盘布局在P21P34
标记信息在P23P24P25P26
封装信息在P19P23P24P25P26P27P28P29P30
技术参数、封装参数在P4
应用领域在P1P4P5P13P36
电气规格在P5P6P15
导航目录
LP5907UVE-1.8/NOPB数据手册
Page:
of 36 Go
若手册格式错乱，请下载阅览PDF原文件
B2
B1
A1 A2
V
IN
V
OUT
Power Ground
V
EN
C
IN
C
OUT
LP5907UV
18
LP5907
SNVS798J –APRIL 2012–REVISED MARCH 2016
www.ti.com
Product Folder Links: LP5907
Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated
Layout Examples (continued)
Figure 26. LP5907UV-x.x (DSBGA) Typical Layout
10.3 X2SON Mounting
The X2SON package thermal pad must be soldered to the printed circuit board for proper thermal and
mechanical performance. For more information, see the Application Report QFN/SON PCB Attachment
(SLUA271).
10.4 DSBGA Mounting
The DSBGA package requires specific mounting techniques, which are detailed in AN-1112 DSBGA Wafer Level
Chip Scale Package (SNVA009). For best results during assembly, alignment ordinals on the PC board may be
used to facilitate placement of the DSBGA device.
10.5 DSBGA Light Sensitivity
Exposing the DSBGA device to direct light may cause incorrect operation of the device. Light sources such as
halogen lamps can affect electrical performance if they are situated in proximity to the device. Light with
wavelengths in the red and infrared part of the spectrum have the most detrimental effect; thus, the fluorescent
lighting used inside most buildings has very little effect on performance.
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