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MCP1825S-1202E/DB 数据手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
稳压芯片
封装:
TO-261-4
描述:
MICROCHIP MCP1825S-1202E/DB 固定电压稳压器, LDO, 2.1V至6V, 210mV压差, 1.2V输出, 500mA输出, SOT-223-3
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P16Hot
典型应用电路图在P3P19P20P21
原理图在P4P5P6
标记信息在P23P24
封装信息在P23P25P26P28P29P32P35
技术参数、封装参数在P8P9P10
应用领域在P1P3
电气规格在P8P9P18P19
导航目录
MCP1825S-1202E/DB数据手册
Page:
of 38 Go
若手册格式错乱，请下载阅览PDF原文件
MCP1825/MCP1825S
DS22056B-page 22 © 2008 Microchip Technology Inc.
5.3.1.2 Junction Temperature Estimate
To estimate the internal junction temperature, the
calculated temperature rise is added to the ambient or
offset temperature. For this example, the worst-case
junction temperature is estimated below:
5.3.1.3 Maximum Package Power
Dissipation at 60°C Ambient
Temperature
From this table, you can see the difference in maximum
allowable power dissipation between the TO-220-5
package and the DDPAK-5 package.
T
J
=T
JRISE
+ T
A(MAX)
T
J
= 15.06°C + 60.0°C
T
J
= 75.06°C
TO-220-5 (29.3°C/W Rθ
JA
):
P
D(MAX)
= (125°C – 60°C) / 29.3°C/W
P
D(MAX)
= 2.218W
DDPAK-5 (31.2°C/Watt Rθ
JA
):
P
D(MAX)
= (125°C – 60°C)/ 31.2°C/W
P
D(MAX)
= 2.083W
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