Datasheet 搜索 > Micron（镁光） > MT41J128M16JT-093:MTR 数据手册 > MT41J128M16JT-093:MTR 数据手册 4/211 页
￥ 0
MT41J128M16JT-093:MTR 数据手册 - Micron（镁光）
制造商:
Micron（镁光）
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
原理图在P14P15P146
封装尺寸在P22P23P24P25
标记信息在P1P2
功能描述在P12P13P146P192
技术参数、封装参数在P26P27P30P31P32P33P34P35P36P37P38P39
电气规格在P26P27P30P31P32P33P34P35P36P37P38P39
型号编号列表在P2
导航目录
MT41J128M16JT-093:MTR数据手册
Page:
of 211 Go
若手册格式错乱，请下载阅览PDF原文件
Input Clock Frequency Change ...................................................................................................................... 124
Write Leveling ............................................................................................................................................... 126
Write Leveling Procedure ........................................................................................................................... 128
Write Leveling Mode Exit Procedure ........................................................................................................... 130
Initialization ................................................................................................................................................. 131
Mode Registers .............................................................................................................................................. 133
Mode Register 0 (MR0) ................................................................................................................................... 134
Burst Length ............................................................................................................................................. 134
Burst Type ................................................................................................................................................. 135
DLL RESET ................................................................................................................................................ 136
Write Recovery .......................................................................................................................................... 136
Precharge Power-Down (Precharge PD) ...................................................................................................... 137
CAS Latency (CL) ....................................................................................................................................... 137
Mode Register 1 (MR1) ................................................................................................................................... 138
DLL ENABLE/DISABLE .............................................................................................................................. 138
Output Drive Strength ............................................................................................................................... 139
OUTPUT ENABLE/DISABLE ...................................................................................................................... 139
TDQS ENABLE .......................................................................................................................................... 139
On-Die Termination (ODT) ........................................................................................................................ 140
WRITE LEVELING ..................................................................................................................................... 140
Posted CAS Additive Latency (AL) ............................................................................................................... 140
Mode Register 2 (MR2) ................................................................................................................................... 142
CAS WRITE Latency (CWL) ........................................................................................................................ 142
AUTO SELF REFRESH (ASR) ....................................................................................................................... 143
SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 143
SRT versus ASR .......................................................................................................................................... 144
Dynamic On-Die Termination (ODT) ......................................................................................................... 144
Mode Register 3 (MR3) ................................................................................................................................... 145
MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 145
MPR Functional Description ...................................................................................................................... 146
MPR Address Definitions and Bursting Order .............................................................................................. 147
MPR Read Predefined Pattern .................................................................................................................... 152
MODE REGISTER SET (MRS) Command ........................................................................................................ 152
ZQ CALIBRATION Operation ......................................................................................................................... 153
ACTIVATE Operation ..................................................................................................................................... 154
READ Operation ............................................................................................................................................ 156
WRITE Operation .......................................................................................................................................... 167
DQ Input Timing ....................................................................................................................................... 175
PRECHARGE Operation ................................................................................................................................. 177
SELF REFRESH Operation
.............................................................................................................................. 177
Extended Temperature Usage ........................................................................................................................ 179
Power-Down Mode ........................................................................................................................................ 180
RESET Operation ........................................................................................................................................... 188
On-Die Termination (ODT) ............................................................................................................................ 190
Functional Representation of ODT ............................................................................................................. 190
Nominal ODT ............................................................................................................................................ 190
Dynamic ODT ............................................................................................................................................... 192
Dynamic ODT Special Use Case ................................................................................................................. 192
Functional Description .............................................................................................................................. 192
Synchronous ODT Mode ................................................................................................................................ 198
ODT Latency and Posted ODT .................................................................................................................... 198
Timing Parameters .................................................................................................................................... 198
2Gb: x4, x8, x16 DDR3 SDRAM
Features
PDF: 09005aef826aaadc
2Gb_DDR3_SDRAM.pdf - Rev. Q 04/13 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2006 Micron Technology, Inc. All rights reserved.
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
