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CDCE72010RGCR 其他数据使用手册 - TI（德州仪器）
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TI（德州仪器）
分类:
时钟发生器
封装:
VQFN-64
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十大输出高性能时钟同步器，抖动消除器和时钟经销商 Ten Output High Performance Clock Synchronizer, Jitter Cleaner, and Clock Distributor
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CDCE72010RGCR数据手册
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Texas Instruments, Inc. PCN# 20140609000B
PCN Number:
20140609000B
PCN Date:
12/16/2014
Title:
Add Cu as Alternative Wire Base Metal for Selected Device(s)
Customer Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality
Services
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Revision B is to remove select devices in the Product Affected Section (with strikethrough) and
highlighted in yellow. Devices with strikethrough and are not highlighted has been retracted
earlier under revision A. These devices were inadvertently added and not affected by this change.
Texas Instruments is pleased to announce the qualification of Cu as an additional bond wire
option for devices listed in “Product affected” section below. Devices will remain in current
assembly facility. Following identifies the material differences for the Product Affected list:
Group 1 – Wire material change only
Group 2 – Wire material and diameter change
Au wire
Cu Bond wire
Wire dia. (Mils)
1.3
1.0
Reason for Change:
Continuity of supply.
1) To align with world technology trends and use wiring with enhanced mechanical and
electrical properties
2) Maximize flexibility within our Assembly/Test production sites.
3) Cu is easier to obtain and stock
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None.
Changes to product identification resulting from this PCN:
None.
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