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IRF1407S 其他数据使用手册 - International Rectifier（国际整流器）
制造商:
International Rectifier（国际整流器）
分类:
MOS管
封装:
TO-263
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3D模型
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IRF1407S数据手册
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Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10VX 100V
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10VX 70V A
I
DM
Pulsed Drain Current QX 520
P
D
@T
A
= 25°C Power Dissipation 3.8 W
P
D
@T
C
= 25°C Power Dissipation 200 W
Linear Derating Factor 1.3 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche EnergyRX 390 mJ
I
AR
Avalanche CurrentQ See Fig.12a, 12b, 15, 16 A
E
AR
Repetitive Avalanche EnergyW mJ
dv/dt Peak Diode Recovery dv/dt SX 4.6 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
HEXFET
®
Power MOSFET
S
D
G
Absolute Maximum Ratings
V
DSS
= 75V
R
DS(on)
= 0.0078Ω
I
D
= 100AV
Description
10/05/01
www.irf.com 1
● Advanced Process Technology
● Ultra Low On-Resistance
● Dynamic dv/dt Rating
● 175°C Operating Temperature
● Fast Switching
● Repetitive Avalanche Allowed up to Tjmax
Benefits
PD -94335
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 0.75 °C/W
R
θJA
Junction-to-Ambient(PCB Mounted,steady-state)** ––– 40
Thermal Resistance
IRF1407S
IRF1407L
TO-262
IRF1407L
D
2
Pak
IRF1407S
Advanced HEXFET
®
Power MOSFETs from International
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The D
2
Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in any
existing surface mount package. The D
2
Pak is suitable for
high current applications because of its low internal connection
resistance and can dissipate up to 2.0W in a typical surface
mount application.
The through-hole version (IRF1407L) is available for low-
profile applications.
**When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer
to application note #AN-994.
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