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ADS4449EVM 数据手册 - TI（德州仪器）
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ADS4449EVM数据手册
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2
ADS4449
SBAS603A –APRIL 2013–REVISED JANUARY 2016
www.ti.com
Product Folder Links: ADS4449
Submit Documentation Feedback Copyright © 2013–2016, Texas Instruments Incorporated
Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 6
6.5 Electrical Characteristics........................................... 7
6.6 Digital Characteristics ............................................... 9
6.7 Timing Requirements.............................................. 10
6.8 Timing Characteristics For Figure 1........................ 10
6.9 Typical Characteristics............................................ 12
6.10 Typical Characteristics: Contour........................... 18
7 Parameter Measurement Information ................ 19
7.1 LVDS Output Timing............................................... 19
8 Detailed Description............................................ 21
8.1 Overview................................................................. 21
8.2 Functional Block Diagram....................................... 21
8.3 Feature Description................................................. 22
8.4 Device Functional Modes........................................ 23
8.5 Programming .......................................................... 26
8.6 Register Maps ........................................................ 28
9 Application and Implementation ........................ 41
9.1 Application Information............................................ 41
9.2 Typical Application.................................................. 41
10 Power Supply Recommendations ..................... 48
11 Layout................................................................... 48
11.1 Layout Guidelines ................................................. 48
11.2 Layout Example ................................................... 48
12 Device and Documentation Support................. 49
12.1 Device Nomenclature............................................ 49
12.2 Documentation Support ........................................ 50
12.3 Community Resources.......................................... 50
12.4 Trademarks........................................................... 50
12.5 Electrostatic Discharge Caution............................ 50
12.6 Glossary................................................................ 50
13 Mechanical, Packaging, and Orderable
Information........................................................... 50
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (April 2013) to Revision A Page
• Added Internal Dither Features bullet .................................................................................................................................... 1
• Added ESD Ratings table, Feature Description section, Device Functional Modes section, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
• Deleted Package and Ordering Information because the data is repeated in the Package Option Addendum ................... 1
• Deleted SNRB from the configuration registers block in the functional block diagram ......................................................... 1
• Changed Clock Inputs, Input clock sample rate parameter minimum specification in Recommended Operating
Conditions table...................................................................................................................................................................... 5
• Changed Table 2 ................................................................................................................................................................. 22
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