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IGB03N120H2
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IGB03N120H2数据手册
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IGB03N120H2
Power Semiconductors
2 Rev. 2.4 Oct. 07
Thermal Resistance
Parameter Symbol Conditions Max. Value Unit
Characteristic
IGBT thermal resistance,
junction – case
R
thJC
2.0
Thermal resistance,
junction – ambient
1)
R
thJA
40
K/W
Electrical Characteristic, at T
j
= 25 °C, unless otherwise specified
Value
Parameter Symbol Conditions
min. Typ. max.
Unit
Static Characteristic
Collector-emitter breakdown voltage
V
(BR)CES
V
GE
=0V, I
C
=300µA
1200 - -
Collector-emitter saturation voltage
V
CE(sat)
V
GE
= 15V, I
C
=3A
T
j
=25°C
T
j
=150°C
V
GE
= 10V, I
C
=3A,
T
j
=25°C
-
-
-
2.2
2.5
2.4
2.8
-
-
Gate-emitter threshold voltage
V
GE(th)
I
C
=90µA,V
CE
=V
GE
2.1 3 3.9
V
Zero gate voltage collector current
I
CES
V
CE
=1200V,V
GE
=0V
T
j
=25°C
T
j
=150°C
-
-
-
-
20
80
µA
Gate-emitter leakage current
I
GES
V
CE
=0V,V
GE
=20V
- - 100 nA
Transconductance
g
fs
V
CE
=20V, I
C
=3A
- 2 - S
Dynamic Characteristic
Input capacitance
C
iss
- 205 -
Output capacitance
C
oss
- 24 -
Reverse transfer capacitance
C
rss
V
CE
=25V,
V
GE
=0V,
f=1MHz
- 7 -
pF
Gate charge
Q
Gate
V
CC
=960V, I
C
=3A
V
GE
=15V
- 22 - nC
Internal emitter inductance
measured 5mm (0.197 in.) from case
L
E
-
7 -
nH
1)
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
2
(one layer, 70µm thick) copper area for
collector connection. PCB is vertical without blown air.

IGB03N120H2 数据手册

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18 页 / 0.77 MByte

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