器件3D模型

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R5F52105BDFM#30 数据手册 - Renesas Electronics（瑞萨电子）

制造商:

Renesas Electronics（瑞萨电子）

分类:

微控制器

封装:

LFQFP-64

描述:

RX210 微控制器RX210 低功率微控制器具有宽工作范围并且可以在高达 50 MHz 78 DMIPS 时执行计算。使用 RX210 的应用包括数码相机、洗衣机、功率计、智能手机、医疗保健设备和冰箱。工作范围：1.62 V 至 5.3 V 事件链接控制器 (ELC) 多功能引脚控制器 (MPC) 三相电动机控制计时器 (MTU2) 12 位模/数转换器 4 种功耗模式： -睡眠模式 -所有模块时钟停止模式 -软件待机模式 -深度软件待机模式 ### RX 系列微控制器，Renesas ElectronicsRX 系列 32 位闪存微控制器持续发展，用于工业、消费品和办公自动化应用。

Pictures:

3D模型

符号图

焊盘图

引脚图

产品图

页面导航:

引脚图在P14P15P16P17P18P19P20P21P22P23P24P25Hot

原理图在P13

封装尺寸在P18P20P23P24P207P208P209P210P211P212P213P214

功能描述在P2P3P4P5P6

技术参数、封装参数在P2P3P4P5P6P87

应用领域在P1

电气规格在P87P88P89P90P91P92P93P94P95P96P97P98

导航目录

引脚图在P14 P15 P16 P17 P18 P19 P20 P21 P22 P23 P24 P25
原理图在P13
封装尺寸在P18 P20 P23 P24 P207 P208 P209 P210 P211 P212 P213 P214
功能描述在P2 P3 P4 P5 P6
技术参数、封装参数在P2 P3 P4 P5 P6 P87
应用领域在P1
电气规格在P87 P88 P89 P90 P91 P92 P93 P94 P95 P96 P97 P98

R5F52105BDFM#30数据手册

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R01DS0041EJ0150 Rev.1.50 Page 2 of 221

Oct 18, 2013

RX210 Group 1. Overview

1.Overview

1.1 Outline of Specifications

Table 1.1 lists the specifications in outline, and Table 1.2 gives a comparison of the functions of products in different

packages.

Table 1.1 is for products with the greatest number of functions, so numbers of peripheral modules and channels will

differ in accord with the package. For details, see Table 1.2, Comparison of Functions for Different Packages.

This product includes chip version A (part no.: R5F5210xAxxx), chip version B (part no.: R5F5210xBxxx), and chip

version C (part no: R5F5210xCxxx).

For the specification differences between chip versions A, B, and C, see Table 1, Specification Differences

Depending on Chip Versions.

Table 1.1 Outline of Specifications (1 / 5)

Classification Module/Function Description

CPU CPU

 Maximum operating frequency: 50 MHz

 32-bit RX CPU

 Minimum instruction execution time: One instruction per state (cycle of the system clock)

 Address space: 4-Gbyte linear

 Register

General purpose: Sixteen 32-bit registers

Control: Eight 32-bit registers

Accumulator: One 64-bit register

 Basic instructions: 73

 DSP instructions: 9

 Addressing modes: 10

 Data arrangement

Instructions: Little endian

Data: Selectable as little endian or big endian

 On-chip 32-bit multiplier: 32  32  64 bits

 On-chip divider: 32 / 32  32 bits

 Barrel shifter: 32 bits

Memory ROM

 Capacity: 64 K/96 K/128 K/256 K/384 K/512 K/768 Kbytes/1 Mbyte

 50 MHz, no-wait memory access

 On-board programming: 3 types

Off-board programming

RAM

 Capacity: 12 K/16 K/20 K/32 K/64 K/96 Kbytes

 50 MHz, no-wait memory access

E2 DataFlash

 Capacity: 8 Kbytes

 Number of times for programming/erasing: 100,000

MCU operating mode Single-chip mode, on-chip ROM enabled expansion mode, and on-chip ROM disabled expansion mode

(software switching)

Clock Clock generation circuit

 Main clock oscillator, sub-clock oscillator, low-speed on-chip oscillator, high-speed on-chip oscillator,

PLL frequency synthesizer, and IWDT-dedicated on-chip oscillator

 Oscillation stop detection

 Measuring circuit for accuracy of clock frequency (clock-accuracy check: CAC)

 Independent settings for the system clock (ICLK), peripheral module clock (PCLK), external bus clock

(BCLK), and FlashIF clock (FCLK)

The CPU and system sections such as other bus masters run in synchronization with the system

clock (ICLK): 50 MHz (at max.)

Peripheral modules run in synchronization with the peripheral module clock (PCLK): 32 MHz (at

max.)

Devices connected to the external bus run in synchronization with the external bus clock (BCLK):

12.5 MHz (at max.)

The flash peripheral circuit runs in synchronization with the FlashIF clock (FCLK): 32 MHz (at max.)

Reset RES# pin reset, power-on reset, voltage monitoring reset, watchdog timer reset, independent watchdog

timer reset, deep software standby reset, and software reset

Voltage detection Voltage detection circuit

(LVDAa)

 When the voltage on VCC falls below the voltage detection level, an internal reset or internal interrupt

is generated.

Voltage detection circuit 0 is capable of selecting the detection voltage from 4 levels

Voltage detection circuit 1 is capable of selecting the detection voltage from 16 levels

Voltage detection circuit 2 is capable of selecting the detection voltage from 16 levels

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