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TPS63020DSJR数据手册
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VOUT
L1
EN
GND
L2
PS/SYNC
VINA
FB
L2
PGND
VIN
L1
PG
VIN
VOUT
PGND
PGND
PGND
PGND
PGND
PGND
PGND
Exposed
Thermal
Pad *)
TPS63020
,
TPS63021
www.ti.com
SLVS916D JULY 2010REVISED OCTOBER 2015
5 Pin Configuration and Functions
DSJ Package
14-Pin VSON With Exposed Thermal Pad
Top View
NOTE: *) The exposed thermal pad is connected to PGND.
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
EN 12 I Enable input (1 enabled, 0 disabled), must not be left open
FB 3 I Voltage feedback of adjustable versions, must be connected to VOUT on fixed output voltage
versions
GND 2 Control / logic ground
L1 8, 9 I Connection for inductor
L2 6, 7 I Connection for inductor
PG 14 O Output power good (1 good, 0 failure; open drain)
PGND Power ground
PS/SYNC 13 I Enable / disable power save mode (1 disabled, 0 enabled, clock signal for synchronization), must
not be left open
VIN 10, 11 I Supply voltage for power stage
VINA 1 I Supply voltage for control stage
VOUT 4, 5 O Buck-boost converter output
Exposed The exposed thermal pad is connected to PGND.
Thermal Pad
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Voltage
(2)
VIN, VINA, L1, L2, VOUT, PS/SYNC, EN, FB, PG –0.3 7 V
Operating junction temperature, T
J
–40 150 °C
Storage temperature, T
stg
–65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to network ground terminal.
Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 3
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TPS63020DSJR 数据手册

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