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TPS63020DSJR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
VSON-14
描述:
TEXAS INSTRUMENTS TPS63020DSJR 直流-直流开关降压, 升压稳压器, 可调, 1.8V-5.5V输入, 1.2V-5.5V/4A输出, 2.4MHz, VSON-14 新
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页面导航:
引脚图在P3Hot
典型应用电路图在P1P12
原理图在P1P7P8
封装尺寸在P22P24P25
标记信息在P22
封装信息在P21P22P23P24P25
技术参数、封装参数在P3
应用领域在P1P29
电气规格在P5P9
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TPS63020DSJR数据手册
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of 29 Go
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TPS63020
,
TPS63021
SLVS916D –JULY 2010–REVISED OCTOBER 2015
www.ti.com
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
±3000
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22-C101, ±1500
all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN NOM MAX UNIT
Supply voltage at VIN, VINA 1.8 5.5 V
Operating free air temperature, T
A
–40 85 °C
Operating junction temperature, T
J
–40 125 °C
6.4 Thermal Information
TPS6302x
THERMAL METRIC
(1)
DSJ (VSON) UNIT
14 PINS
R
θJA
Junction-to-ambient thermal resistance 41.8 °C/W
R
θJC(top)
Junction-to-case(top) thermal resistance 47 °C/W
R
θJB
Junction-to-board thermal resistance 17 °C/W
ψ
JT
Junction-to-top characterization parameter 0.9 °C/W
ψ
JB
Junction-to-board characterization parameter 16.8 °C/W
R
θJC(bot)
Junction-to-case(bottom) thermal resistance 3.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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Product Folder Links: TPS63020 TPS63021
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