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BZD27C51P-GS08
0.405
导航目录
  • 封装尺寸在P5
  • 焊盘布局在P5
  • 标记信息在P2
  • 封装信息在P1
  • 技术参数、封装参数在P1
  • 电气规格在P1P2P3
BZD27C51P-GS08数据手册
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BZD27C3V6P to BZD27C200P
Document Number 85810
Rev. 1.8, 13-Apr-05
Vishay Semiconductors
www.vishay.com
1
17249
Zener Diodes with Surge Current Specification
Features
Sillicon Planar Zener Diodes
Low profile surface-mount package
Zener and surge current specification
Low leakage current
Excellent stability
High temperature soldering:
260 °C/10 sec. at terminals
Lead (Pb)-free component
Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
Mechanical Data
Case: JEDEC DO-219AB (SMF
®
) Plastic case
Weight: approx. 15 mg
Packaging codes/options:
GS18 / 10 k per 13 " reel, (8 mm tape), 50 k/box
GS08 / 3 k per 7 " reel, (8 mm tape), 30 k/box
Absolute Maximum Ratings
T
amb
= 25 °C, unless otherwise specified
1)
Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads ( 40 µm thick)
2)
T
J
= 25 °C prior to surge
Thermal Characteristics
T
amb
= 25 °C, unless otherwise specified
1)
Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads ( 40 µm thick)
Electrical Characteristics
T
amb
= 25 °C, unless otherwise specified
Parameter Test condition Symbol Value Unit
Power dissipation T
L
= 80 °C P
tot
2.3 W
T
A
= 25 °C P
tot
0.8
1)
W
Non-repetitive peak pulse power
dissipation
100 µs square pulse
2)
P
ZSM
300 W
10/1000 µs waveform (BZD27-
C7V5P to BZD27-C100P)
2)
P
RSM
150 W
10/1000 µs waveform (BZD27-
C110P to BZD27-C200P)
2)
P
RSM
100 W
Parameter Test condition Symbol Value Unit
Thermal resistance junction to ambient air
1)
R
thJA
180 K/W
Thermal resistance junction to lead R
thJL
30 K/W
Maximum junction temperature T
j
150 °C
Storage temperature range T
S
- 55 to + 150 °C
Parameter Test condition Symbol Min Ty p. Max Unit
Forward voltage I
F
= 0.2 A V
F
1.2 V
e3

BZD27C51P-GS08 数据手册

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