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ADSP-BF514BBCZ-3 数据手册 - ADI(亚德诺)
制造商:
ADI(亚德诺)
分类:
DSP数字信号处理器
封装:
LFBGA-168
描述:
Blackfin嵌入式处理器 Blackfin Embedded Processor
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P59P60Hot
原理图在P1P6
封装尺寸在P28P65
型号编码规则在P23P28P67
功能描述在P3P12
技术参数、封装参数在P1P9P13P22P27P29P55P67
应用领域在P1
电气规格在P24P25P26P27
导航目录
ADSP-BF514BBCZ-3数据手册
Page:
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Rev. D | Page 2 of 68 | April 2014
ADSP-BF512/BF514/BF514F16/BF516/BF518/BF518F16
TABLE OF CONTENTS
Features ................................................................. 1
Memory ................................................................ 1
Peripherals ............................................................. 1
General Description ................................................. 3
Portable Low Power Architecture ............................. 3
System Integration ................................................ 3
Blackfin Processor Core .......................................... 3
Memory Architecture ............................................ 5
Event Handling .................................................... 7
DMA Controllers .................................................. 8
Processor Peripherals ............................................. 8
Dynamic Power Management ................................ 12
Voltage Regulation Interface .................................. 14
Clock Signals ..................................................... 14
Booting Modes ................................................... 15
Instruction Set Description ................................... 16
Development Tools ............................................. 16
Additional Information ........................................ 18
Related Signal Chains .......................................... 18
Lockbox Secure Technology Disclaimer ................... 18
Signal Descriptions ................................................. 19
Specifications ........................................................ 22
Operating Conditions ........................................... 22
Electrical Characteristics ....................................... 24
Flash Memory Characteristics ................................ 26
Absolute Maximum Ratings ................................... 27
Package Information ............................................ 28
ESD Sensitivity ................................................... 28
Timing Specifications ........................................... 29
Output Drive Currents ......................................... 52
Test Conditions .................................................. 54
Thermal Characteristics ........................................ 58
176-Lead LQFP_EP Lead Assignment ......................... 59
168-Ball CSP_BGA Ball Assignment ........................... 62
Outline Dimensions ................................................ 65
Surface-Mount Design .......................................... 66
Automotive Products .............................................. 67
Ordering Guide ..................................................... 67
REVISION HISTORY
4/14—Rev. C to Rev. D
This Rev D product data sheet includes Flash memory specifica-
tions that differ from all previous data sheet versions (A, B, C).
The Flash memory specifications contained in the Rev D prod-
uct data sheet are appropriate only for those products that
include 16M bit SPI Flash memory.
These changes are reflected in the following sections:
Processor Comparison .............................................. 3
Flash Memory ......................................................... 5
Operating Conditions ............................................. 22
Electrical Characteristics .......................................... 24
Flash Memory Characteristics ................................... 26
Ordering Guide ..................................................... 67
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