Datasheet 搜索 > Flash芯片 > Winbond Electronics（华邦电子股份） > W25Q64FVSSIG 数据手册 > W25Q64FVSSIG 数据手册 2/92 页
器件3D模型￥ 9.537
W25Q64FVSSIG 数据手册 - Winbond Electronics（华邦电子股份）
制造商:
Winbond Electronics（华邦电子股份）
分类:
Flash芯片
封装:
SOIC-8
描述:
64-Mbit(8M x 8bit)，SPI接口，工作电压：2.7V to 3.6V
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P6P7P8P11Hot
原理图在P12
型号编码规则在P89
标记信息在P90
封装信息在P5P89
功能描述在P5P13
技术参数、封装参数在P72
应用领域在P15
电气规格在P30P31P33P34P66P72P74P76P77
型号编号列表在P90
导航目录
W25Q64FVSSIG数据手册
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Table of Contents
1. GENERAL DESCRIPTION ............................................................................................................... 5
2. FEATURES ....................................................................................................................................... 5
3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6
3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 6
3.2 Pad Configuration WSON 6x5-mm / 8X6-mm, XSON 4x4-mm ........................................... 6
3.3 Pin Configuration PDIP 300-mil ............................................................................................ 7
3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm, XSON 4x4-mm and PDIP 300-
mil 7
3.5 Pin Configuration SOIC 300-mil ........................................................................................... 8
3.6 Pin Description SOIC 300-mil ............................................................................................... 8
3.7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 9
3.8 Ball Description TFBGA 8x6-mm ......................................................................................... 9
3.9 Ball Configuration WLCSP ................................................................................................. 10
3.10 Ball Description WLCSP ..................................................................................................... 10
4. PIN DESCRIPTIONS ...................................................................................................................... 11
4.1 Chip Select (/CS) ................................................................................................................ 11
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 11
4.3 Write Protect (/WP) ............................................................................................................ 11
4.4 HOLD (/HOLD) ................................................................................................................... 11
4.5 Serial Clock (CLK) .............................................................................................................. 11
5. BLOCK DIAGRAM .......................................................................................................................... 12
6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 13
6.1 SPI/QPI OPERATIONS ...................................................................................................... 13
6.1.1 Standard SPI Instructions ..................................................................................................... 13
6.1.2 Dual SPI Instructions ............................................................................................................ 13
6.1.3 Quad SPI Instructions ........................................................................................................... 14
6.1.4 QPI Instructions .................................................................................................................... 14
6.1.5 Hold Function ....................................................................................................................... 14
6.2 WRITE PROTECTION ....................................................................................................... 15
6.2.1 Write Protect Features ......................................................................................................... 15
7. STATUS REGISTERS AND INSTRUCTIONS ............................................................................... 16
7.1 STATUS REGISTERS ........................................................................................................ 16
7.1.1 BUSY .................................................................................................................................... 16
7.1.2 Write Enable Latch (WEL) .................................................................................................... 16
7.1.3 Block Protect Bits (BP2, BP1, BP0) ...................................................................................... 16
7.1.4 Top/Bottom Block Protect (TB) ............................................................................................. 16
7.1.5 Sector/Block Protect (SEC) .................................................................................................. 16
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