Datasheet 搜索 > Flash芯片 > Winbond Electronics（华邦电子股份） > W25Q64FVSSIG 数据手册 > W25Q64FVSSIG 数据手册 3/92 页
器件3D模型￥ 9.537
W25Q64FVSSIG 数据手册 - Winbond Electronics（华邦电子股份）
制造商:
Winbond Electronics（华邦电子股份）
分类:
Flash芯片
封装:
SOIC-8
描述:
64-Mbit(8M x 8bit)，SPI接口，工作电压：2.7V to 3.6V
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P6P7P8P11Hot
原理图在P12
型号编码规则在P89
标记信息在P90
封装信息在P5P89
功能描述在P5P13
技术参数、封装参数在P72
应用领域在P15
电气规格在P30P31P33P34P66P72P74P76P77
型号编号列表在P90
导航目录
W25Q64FVSSIG数据手册
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W25Q64FV
Publication Release Date: June 14, 2016
- 3 - Revision Q
7.1.6 Complement Protect (CMP) .................................................................................................. 16
7.1.7 Status Register Protect (SRP1, SRP0) ................................................................................. 17
7.1.8 Erase/Program Suspend Status (SUS) ................................................................................ 17
7.1.9 Security Register Lock Bits (LB3, LB2, LB1) ........................................................................ 17
7.1.10 Quad Enable (QE) .............................................................................................................. 17
7.1.11 W25Q64FV Status Register Memory Protection (CMP = 0) ............................................... 19
7.1.12 W25Q64FV Status Register Memory Protection (CMP = 1) ............................................... 20
7.2 INSTRUCTIONS ................................................................................................................. 21
7.2.1 Manufacturer and Device Identification ................................................................................ 21
7.2.2 Instruction Set Table 1 (Standard SPI Instructions)
(1)
........................................................... 22
7.2.3 Instruction Set Table 2 (Dual SPI Instructions) ..................................................................... 23
7.2.4 Instruction Set Table 3 (Quad SPI Instructions) ................................................................... 23
7.2.5 Instruction Set Table 4 (QPI Instructions)
(14)
........................................................................ 24
7.2.6 Write Enable (06h) ............................................................................................................... 26
7.2.7 Write Enable for Volatile Status Register (50h) .................................................................... 26
7.2.8 Write Disable (04h) ............................................................................................................... 27
7.2.9 Read Status Register-1 (05h) and Read Status Register-2 (35h) ........................................ 27
7.2.10 Write Status Register (01h) ................................................................................................ 28
7.2.11 Read Data (03h) ................................................................................................................. 30
7.2.12 Fast Read (0Bh) ................................................................................................................. 31
7.2.13 Fast Read Dual Output (3Bh) ............................................................................................. 33
7.2.14 Fast Read Quad Output (6Bh) ............................................................................................ 34
7.2.15 Fast Read Dual I/O (BBh) ................................................................................................... 35
7.2.16 Fast Read Quad I/O (EBh) ................................................................................................. 37
7.2.17 Word Read Quad I/O (E7h) ................................................................................................ 40
7.2.18 Octal Word Read Quad I/O (E3h) ....................................................................................... 42
7.2.19 Set Burst with Wrap (77h) .................................................................................................. 44
7.2.20 Page Program (02h) ........................................................................................................... 45
7.2.21 Quad Input Page Program (32h) ........................................................................................ 47
7.2.22 Sector Erase (20h) ............................................................................................................. 48
7.2.23 32KB Block Erase (52h) ..................................................................................................... 49
7.2.24 64KB Block Erase (D8h) ..................................................................................................... 50
7.2.25 Chip Erase (C7h / 60h) ....................................................................................................... 51
7.2.26 Erase / Program Suspend (75h) ......................................................................................... 52
7.2.27 Erase / Program Resume (7Ah) ......................................................................................... 54
7.2.28 Power-down (B9h) .............................................................................................................. 55
7.2.29 Release Power-down / Device ID (ABh) ............................................................................. 56
7.2.30 Read Manufacturer / Device ID (90h) ................................................................................. 58
7.2.31 Read Manufacturer / Device ID Dual I/O (92h) ................................................................... 59
7.2.32 Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 60
7.2.33 Read Unique ID Number (4Bh)........................................................................................... 61
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