Datasheet 搜索 > Flash芯片 > Winbond Electronics（华邦电子股份） > W25Q64FVSSIG 数据手册 > W25Q64FVSSIG 数据手册 4/92 页
器件3D模型￥ 9.537
W25Q64FVSSIG 数据手册 - Winbond Electronics（华邦电子股份）
制造商:
Winbond Electronics（华邦电子股份）
分类:
Flash芯片
封装:
SOIC-8
描述:
64-Mbit(8M x 8bit)，SPI接口，工作电压：2.7V to 3.6V
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P6P7P8P11Hot
原理图在P12
型号编码规则在P89
标记信息在P90
封装信息在P5P89
功能描述在P5P13
技术参数、封装参数在P72
应用领域在P15
电气规格在P30P31P33P34P66P72P74P76P77
型号编号列表在P90
导航目录
W25Q64FVSSIG数据手册
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W25Q64FV
- 4 -
7.2.34 Read JEDEC ID (9Fh) ........................................................................................................ 62
7.2.35 Read SFDP Register (5Ah) ................................................................................................ 63
7.2.36 Erase Security Registers (44h) ........................................................................................... 64
7.2.37 Program Security Registers (42h) ...................................................................................... 65
7.2.38 Read Security Registers (48h) ........................................................................................... 66
7.2.39 Set Read Parameters (C0h) ............................................................................................... 67
7.2.40 Burst Read with Wrap (0Ch) ............................................................................................... 68
7.2.41 Enable QPI (38h) ................................................................................................................ 69
7.2.42 Disable QPI (FFh) ............................................................................................................... 70
7.2.43 Enable Reset (66h) and Reset (99h) .................................................................................. 71
8. ELECTRICAL CHARACTERISTICS ............................................................................................... 72
8.1 Absolute Maximum Ratings
(1)(2)
...................................................................................... 72
8.2 Operating Ranges............................................................................................................... 72
8.3 Power-up Power-down Timing and Requirements
(1)
......................................................... 73
8.4 DC Electrical Characteristics .............................................................................................. 74
8.5 AC Measurement Conditions
(1)
......................................................................................... 75
8.6 AC Electrical Characteristics .............................................................................................. 76
AC Electrical Characteristics (cont’d) ........................................................................................... 77
8.7 Serial Output Timing ........................................................................................................... 78
8.8 Serial Input Timing .............................................................................................................. 78
8.9 /HOLD Timing ..................................................................................................................... 78
8.10 /WP Timing ......................................................................................................................... 78
9. PACKAGE SPECIFICATION .......................................................................................................... 79
9.1 8-Pin SOIC 208-mil (Package Code SS) ............................................................................ 79
9.2 8-Pin VSOP 208-mil (Package Code ST) ........................................................................... 80
9.3 8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 81
9.4 8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 82
9.5 8-Pad WSON 8x6-mm (Package Code ZE) ....................................................................... 83
9.6 8-Pad XSON 4x4x0.45-mm (Package Code XG) .............................................................. 84
9.7 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 85
9.8 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) .......................................... 86
9.9 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................. 87
9.10 16-Ball WLCSP (Package Code BY) .................................................................................. 88
9.11 Ordering Information ........................................................................................................... 89
9.12 Valid Part Numbers and Top Side Marking ........................................................................ 90
10. REVISION HISTORY ...................................................................................................................... 91
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