Datasheet 搜索 > Flash芯片 > Winbond Electronics（华邦电子股份） > W25Q64FVSSIG 数据手册 > W25Q64FVSSIG 数据手册 6/92 页
器件3D模型￥ 9.537
W25Q64FVSSIG 数据手册 - Winbond Electronics（华邦电子股份）
制造商:
Winbond Electronics（华邦电子股份）
分类:
Flash芯片
封装:
SOIC-8
描述:
64-Mbit(8M x 8bit)，SPI接口，工作电压：2.7V to 3.6V
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P6P7P8P11Hot
原理图在P12
型号编码规则在P89
标记信息在P90
封装信息在P5P89
功能描述在P5P13
技术参数、封装参数在P72
应用领域在P15
电气规格在P30P31P33P34P66P72P74P76P77
型号编号列表在P90
导航目录
W25Q64FVSSIG数据手册
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W25Q64FV
Publication Release Date: June 14, 2016
- 6 - Revision Q
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q64FV is offered in an 8-pin SOIC 208-mil (package code SS), an 8-pin VSOP 208-mil (package
code ST), an 8-pad WSON 6x5-mm or 8x6-mm (package code ZP & ZE), an 8-pin PDIP 300-mil
(package code DA), a 16-pin SOIC 300-mil (package code SF) and a 24-ball (5x5-1 or 6x4 balls) 8x6-mm
TFBGA (package code TB & TC) as shown in Figure 1a-e respectively. Package diagrams and
dimensions are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC / VSOP 208-mil
1
2
3
4
8
7
6
5
/CS
DO (IO
1
)
/WP (IO
2
)
GND
VCC
/HOLD (IO
3
)
DI (IO
0
)
CLK
Top View
Figure 1a. W25Q64FV Pin Assignments, 8-pin SOIC / VSOP 208-mil (Package Code SS / ST)
3.2 Pad Configuration WSON 6x5-mm / 8X6-mm, XSON 4x4-mm
1
2
3
4
/CS
DO (IO
1
)
/WP (IO
2
)
GND
VCC
/HOLD (IO
3
)
DI (IO
0
)
CLK
Top View
8
7
6
5
Figure 1b. W25Q64FV Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm (Package Code ZP / ZE)
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